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This document presents guidelines for the industrial assembly of an AirPrime HL78xx embedded module on an application.
Designed to suit the needs of manufacturers of small host devices in high-volume production, the AirPrime HL78xx offers LTE connectivity in a compact and lightweight form factor based on standard 15x18 mm LGA (Land Grid Array).
This document describes the features and specifications of the AirPrime HL7800 and HL7800-M embedded modules and provides you with the information required to integrate it into your products.