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The AirPrime SL5011 embedded module is a 74-pin soldered down module based on the Intel pin-out specification proposal for the standard JEDEC LGA packaging form factor. Its wireless modem provides CDMA and 1xEV-DO wireless data connectivity for eBooks, portable navigation devices, mobile Internet devices, point-of-sale devices, industrial handhelds and other machine-to-machine and vertical applications.
This document describes the AT Command set used with the AirPrime SL5011 embedded module.
This document describes how to set up the SL Series Mechanical Socket Development Kit (board version 1400746-B) with an AirPrime SL Series embedded module (SL6087, SL808x, SL809x and SL5011).
This document describes the Universal SL Development Kit and how it integrates with the AirPrime SL Series Embedded Wireless Module via a socket board. It discusses the different interface and peripheral connections supported by the AirPrime SL Development Kit and provides schematics.