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This document presents guidelines for the industrial assembly of an AirPrime SL Series embedded wireless module on an application.
Designed to suit the needs of manufacturers of small host devices in high-volume production, the AirPrime SL Series offers EDGE, HSDPA, HSPA+ and EV-DO Rev A connectivity in a compact and lightweight form factor based on standard 25x30 mm LGA (Land Grid Array).
This document describes the features and specifications of the AirPrime SL6087 EDGE module and provides you with the information required to integrate the SL6087 into your products.
This document describes the features and specifications of the AirPrime SL808xT, SL808xBT and SL808xBTA 3G modules and provides you with the information required to integrate the module into your products.
This document describes the features and specifications of the AirPrime SL809x 3G module and provides you with the information required to integrate the SL809x into your products.
This document describes the features and specifications of the AirPrime SL5011 EV-DO Rev A module and provides you with the information required to integrate the AirPrime SL5011 into your products.
This document describes the features and specifications of the AirPrime SL9090 Embedded Module and provides you with the information required to integrate the SL9090 into your products.