This document presents guidelines for the industrial assembly of the WPX5/WP76/WP77 Series embedded module on an application.

This document presents guidelines for the industrial assembly of the AirPrime Snap-in Socket on an application.

The AirPrime WP76xx MiniCard Accessory Board belongs to the AirPrime MC Series product family and provides data connectivity on LTE, UMTS and (WP7607 only) GSM wireless networks.

This page provides links to specific Customer Process Guidelines for various AirPrime products.

CAD file archive to ease customer hardware design

This document describes the method and test results used to provide a thermal model of the AirPrime WP7702 module. The goal of this document is to provide customers with a thermal model to carry out product thermal simulation and design with AirPrime WP77 series modules.

These files are the 3D models for 2.5mm-height AirPrime WP-series modules and snap-in sockets.

These files are the 3D models for 4.4mm-height AirPrime WP-series modules and snap-in sockets.

This document defines the high-level product features and illustrates the interfaces for the AirPrime WP7502 and WP7504 Smart Embedded Modules. It covers the hardware aspects of the product series, including electrical and mechanical.

This document defines the high-level product features and illustrates the interfaces for the AirPrime WP8548 and WP8548-G Smart Embedded Modules. It covers the hardware aspects of the product series, including electrical and mechanical.

This document describes the features and specifications of the AirPrime WP710x-G embedded module (with variants WP7100-G, WP7102-G and WP7104-G) and provides you with the information required to integrate it into your products.

Archive contain CAD files to ease customer hardware design: Neutral (CAD software) Odb++ (CAD software) Pantheon (CAD software Gerber files (Manufacturing files “CAM software”) DXF file (Mechanics file)